1.Device:
▪Light Source
2.Industry:
▪Car headlights
3.Customer's pain point:
▪Insufficient heat conduction.
4.Current PCB technologies (with photos of our products):
▪Using DPC technology
5.Degree of problem solving:
▪Adopt aluminum nitride ceramic substrate to effectively solve the problem of chip thermal conductivity.
6.Time to adopt new PCB:
▪2023
7.Total number of orders to date (approximate, may be exaggerated):
▪8KK/month
