XRMK specializes in advanced 3D ceramic packaging substrates, designed for high-performance microelectronics and innovative packaging solutions. Our 3D ceramic substrates leverage cutting-edge technologies to provide enhanced electrical and thermal conductivity, ensuring reliability and performance in compact and complex designs. These substrates are ideal for applications in telecommunications, automotive electronics, and medical devices, where space and performance constraints demand precision. By utilizing DPC (Direct Plated Copper) and AMB (Active Metal Brazing) processes, we offer customized solutions that meet the specific needs of each application. At XRMK, our 3D ceramic packaging substrates enable higher efficiency and miniaturization, making them an essential component for the next generation of microelectronic systems.
Ceramics is in our company name, implying that ceramic-based circuit manufacturing is our focus service direction, including the use of DPC process, DBC process and AMB process, forming our full-service technical capabilities.
The introduction of thick film process and thin film process enables us to better adapt to the needs of special microelectronic products and realize the functionalization of circuit substrates.
