This product is a high-performance 3D Aluminum Nitride (AlN) ceramic packaging substrate specifically designed for UVA curing modules. It is manufactured using advanced DPC (Direct Plated Copper) technology integrated with a dam structure to achieve a complex three-dimensional circuit layout within a compact 35mm x 45mm footprint. This product perfectly combines the exceptional thermal conductivity of AlN ceramic, its coefficient of thermal expansion (CTE) matched to semiconductor chips, and the high-precision, high-adhesion circuitry of the DPC process. It provides an ideal thermal management, electrical interconnection, and hermetic protection solution for high-power UVA LED chips, designed to significantly enhance the power density, light output efficiency, and long-term reliability of curing modules.
Core Material: Utilizes high thermal conductivity Aluminum Nitride (AlN) ceramic, with a thermal conductivity of 170-200 W/mK. It rapidly dissipates heat generated by UVA LED chips, effectively lowering the junction temperature and ensuring high efficacy and longevity under high-power operation.
Integrated Dam: A 3D dam is formed in one piece via the DPC process, providing a precise cavity for subsequent phosphor/silicone gel filling, preventing overflow, and ensuring consistency and aesthetics of the light-emitting surface.
Precision Circuit Patterns: The DPC process creates a strong bond between the copper layer and the ceramic substrate. The circuit lines feature high precision (line width/space can reach 30-50µm) and a smooth surface, making it ideal for advanced die-attach methods like eutectic soldering or silver sintering.
Matched CTE: The CTE of AlN ceramic is close to that of semiconductor materials like GaN and Si, significantly reducing the risk of interface failure caused by thermal stress during temperature cycling.
Excellent Environmental Resistance: The ceramic material is inherently resistant to high temperatures, UV aging, moisture, and offers excellent electrical insulation, ensuring long-term stable performance in harsh environments.
Double-Layer Circuit Layout: The 2-layer circuit design offers greater flexibility for routing, enabling better separation of power and ground lines, reducing parasitic inductance, and improving high-frequency switching performance.
This product is designed for applications requiring high-intensity, high-uniformity UVA light sources, primarily used in:
Industrial Curing: Equipment for rapid curing of UV adhesives, inks, coatings, and resins.
3D Printing: As the core light source module for VAT polymerization (SLA/DLP) rapid prototyping systems.
Electronics Assembly: For curing conformal coatings and underfill materials.
Medical Disinfection: Can be used in certain medical devices for specific wavelength curing or disinfection modules.
Research & Analysis: As an excitation light source in analytical instruments.
Q1: Why choose Aluminum Nitride over Aluminum Oxide for the substrate?
A1: Aluminum Nitride has a much higher thermal conductivity (~180 W/mK) compared to Aluminum Oxide (~25 W/mK). For high-power-density UVA curing modules, heat dissipation is the core challenge. AlN dissipates chip heat more efficiently, allowing the module to operate at higher power or extend its service life.
Q2: What are the advantages of the DPC process compared to traditional thick film printing or LTCC?
A2: The DPC process involves sputtering and pattern plating onto the ceramic to form circuits. Its advantages include:
（1）Higher circuit precision, suitable for high-density packaging.
（2）Higher purity copper layers, offering better electrical and thermal conductivity.
（3） Excellent surface flatness, ideal for chip eutectic bonding.
（4）Enables precise, monolithic 3D dam structures, enhancing reliability.
Q3: Can this substrate withstand the high temperatures from UVA LEDs and environmental thermal shock?
A3: Absolutely. Aluminum Nitride ceramic itself can withstand high temperatures (>800°C). The bond between the DPC copper layer and the ceramic is metallurgical, providing strong adhesion that can withstand severe temperature fluctuations. Its excellent thermal management capability is specifically designed for high-temperature environments.
Q4: Can the height and width of the dam be customized?
A4: Yes. The dam dimensions (height, top/bottom width) can be customized according to your requirements for gel volume, viewing angle, and structural strength. Please provide your specific needs when inquiring or placing an order.
Q5: Can the circuit pattern on this substrate be customized?
A5: Yes, we offer customization services. You only need to provide your desired circuit layout, pad locations, dam dimensions, etc., and we can perform targeted design and production for you.
This product is a high-performance 3D Aluminum Nitride (AlN) ceramic packaging substrate specifically designed for UVA curing modules. It is manufactured using advanced DPC (Direct Plated Copper) technology integrated with a dam structure to achieve a complex three-dimensional circuit layout within a compact 35mm x 45mm footprint. This product perfectly combines the exceptional thermal conductivity of AlN ceramic, its coefficient of thermal expansion (CTE) matched to semiconductor chips, and the high-precision, high-adhesion circuitry of the DPC process. It provides an ideal thermal management, electrical interconnection, and hermetic protection solution for high-power UVA LED chips, designed to significantly enhance the power density, light output efficiency, and long-term reliability of curing modules.
Core Material: Utilizes high thermal conductivity Aluminum Nitride (AlN) ceramic, with a thermal conductivity of 170-200 W/mK. It rapidly dissipates heat generated by UVA LED chips, effectively lowering the junction temperature and ensuring high efficacy and longevity under high-power operation.
Integrated Dam: A 3D dam is formed in one piece via the DPC process, providing a precise cavity for subsequent phosphor/silicone gel filling, preventing overflow, and ensuring consistency and aesthetics of the light-emitting surface.
Precision Circuit Patterns: The DPC process creates a strong bond between the copper layer and the ceramic substrate. The circuit lines feature high precision (line width/space can reach 30-50µm) and a smooth surface, making it ideal for advanced die-attach methods like eutectic soldering or silver sintering.
Matched CTE: The CTE of AlN ceramic is close to that of semiconductor materials like GaN and Si, significantly reducing the risk of interface failure caused by thermal stress during temperature cycling.
Excellent Environmental Resistance: The ceramic material is inherently resistant to high temperatures, UV aging, moisture, and offers excellent electrical insulation, ensuring long-term stable performance in harsh environments.
Double-Layer Circuit Layout: The 2-layer circuit design offers greater flexibility for routing, enabling better separation of power and ground lines, reducing parasitic inductance, and improving high-frequency switching performance.
This product is designed for applications requiring high-intensity, high-uniformity UVA light sources, primarily used in:
Industrial Curing: Equipment for rapid curing of UV adhesives, inks, coatings, and resins.
3D Printing: As the core light source module for VAT polymerization (SLA/DLP) rapid prototyping systems.
Electronics Assembly: For curing conformal coatings and underfill materials.
Medical Disinfection: Can be used in certain medical devices for specific wavelength curing or disinfection modules.
Research & Analysis: As an excitation light source in analytical instruments.
Q1: Why choose Aluminum Nitride over Aluminum Oxide for the substrate?
A1: Aluminum Nitride has a much higher thermal conductivity (~180 W/mK) compared to Aluminum Oxide (~25 W/mK). For high-power-density UVA curing modules, heat dissipation is the core challenge. AlN dissipates chip heat more efficiently, allowing the module to operate at higher power or extend its service life.
Q2: What are the advantages of the DPC process compared to traditional thick film printing or LTCC?
A2: The DPC process involves sputtering and pattern plating onto the ceramic to form circuits. Its advantages include:
（1）Higher circuit precision, suitable for high-density packaging.
（2）Higher purity copper layers, offering better electrical and thermal conductivity.
（3） Excellent surface flatness, ideal for chip eutectic bonding.
（4）Enables precise, monolithic 3D dam structures, enhancing reliability.
Q3: Can this substrate withstand the high temperatures from UVA LEDs and environmental thermal shock?
A3: Absolutely. Aluminum Nitride ceramic itself can withstand high temperatures (>800°C). The bond between the DPC copper layer and the ceramic is metallurgical, providing strong adhesion that can withstand severe temperature fluctuations. Its excellent thermal management capability is specifically designed for high-temperature environments.
Q4: Can the height and width of the dam be customized?
A4: Yes. The dam dimensions (height, top/bottom width) can be customized according to your requirements for gel volume, viewing angle, and structural strength. Please provide your specific needs when inquiring or placing an order.
Q5: Can the circuit pattern on this substrate be customized?
A5: Yes, we offer customization services. You only need to provide your desired circuit layout, pad locations, dam dimensions, etc., and we can perform targeted design and production for you.
