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Ceramic PCB

Manufacturing Expert

Full-Service Technical

Professional production management team composed of experts in semiconductor and PCB chemical materials with more than 15 years of experience.

Thick Film Circuit for High-Power Devices

Applications

Company Introduction

Specialised In Ceramic PCB And Packaging
Substrate Manufacturing

Ceramics is in our company name, implying that ceramic-based circuit manufacturing is our focus service direction, including the use of DPC process, DBC process and AMB process, forming our full-service technical capabilities.

The introduction of thick film process and thin film process enables us to better adapt to the needs of special microelectronic products and realize the functionalization of circuit substrates.

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Covering Area

Ceramic PCB Manufacturing with DPC Process

Our Advantages

Ceramic substrate full-process factory.

Full system detection management model (ERP system, MES system, PMS system, OA system)

Complete product system: perfect R&D, engineering, production and sales service system.

Ceramic substrate factory based on semiconductor technology.

Professional production management team composed of experts in semiconductor and PCB chemical materials with more than 15 years of experience.

Stable quality, fast production, perfect service.

Product Applications

Chip Aging

The thermal expansion coefficient of ceramics is similar to that of chip materials.

Chip Testing

The thermal expansion coefficient of ceramics is similar to that of semiconductor materials, which can reduce the stress caused by temperature changes.

Thermoelectric Cooler

Ceramic materials have high thermal conductivity and can effectively conduct heat, ensuring efficient cooling or heating performance of TEC.

Car Headlights

Adopt aluminum nitride ceramic substrate to effectively solve the problem of chip thermal conductivity.

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Micro DPC Ceramic Circuit Board for LED Lighting

DPC processing 3D Ceramic Substrate for UVA

DPC processing 3D Ceramic Packaging Substrate for UVA

DPC process 3D Ceramic Packaging Substrate for UVA Curing Module

3D Ceramic Packaging Substrate for UVA Frontside Mounting

General DPC Ceramic Substrate for LED Lighting

Customization

Ceramic-based circuit manufacturing is our focus service direction, including the use of DPC process, DBC process and AMB process, forming our full-service technical capabilities.

The introduction of thick film process and thin film process enables us to better adapt to the needs of special microelectronic products and realize the functionalization of circuit substrates.