3.5×3.5mm DPC Alumina Ceramic Substrate - For General LED Lighting
This product is a ceramic substrate specifically designed for general LED lighting applications. Using high-purity alumina ceramic substrate and Direct Plated Copper technology, it achieves precise double-layer circuit structure within a compact 3.5×3.5mm size. The product offers good heat dissipation performance, excellent insulation characteristics and stable mechanical strength, providing reliable thermal and electrical connection solutions for medium-power LED chips.
Thermal conductivity: 24-28 W/(m·K)
Thermal resistance: ＜8 K/W
Maximum power capacity: 5W
Withstand voltage: ≥2.0 kV
Insulation resistance: ≥10¹¹ Ω
Dielectric constant: 9.8 @1MHz
Circuit accuracy: ±25 μm
Pad coplanarity: ≤15 μm
Copper thickness: 30-100 μm adjustable
Operating temperature: -40℃～125℃
Thermal cycle performance: -40℃～85℃ ＞500 cycles
Moisture sensitivity: MSL Level 3
Indoor commercial lighting
Residential lighting sources
Industrial auxiliary lighting
Landscape decorative lighting
Emergency lighting systems
Special equipment indicator lights
Q: Can alumina substrate meet thermal requirements for medium-power LEDs?
A: For applications below 5W, alumina substrate's thermal performance is fully adequate with better cost advantage.
Q: Support for multi-chip integration?
A: Up to 4 LED chips can be integrated in 3.5×3.5mm size with various connection options.
Q: How about mass production stability?
A: Standardized DPC process ensures key parameters CPK≥1.33 for consistent batch quality.
Q: Customization service available?
A: Supports customization of pad size, circuit layout and surface treatment according to requirements.
Q: What is the product lifespan?
A: Product life exceeds 50,000 hours under rated operating conditions.
3.5×3.5mm DPC Alumina Ceramic Substrate - For General LED Lighting
This product is a ceramic substrate specifically designed for general LED lighting applications. Using high-purity alumina ceramic substrate and Direct Plated Copper technology, it achieves precise double-layer circuit structure within a compact 3.5×3.5mm size. The product offers good heat dissipation performance, excellent insulation characteristics and stable mechanical strength, providing reliable thermal and electrical connection solutions for medium-power LED chips.
Thermal conductivity: 24-28 W/(m·K)
Thermal resistance: ＜8 K/W
Maximum power capacity: 5W
Withstand voltage: ≥2.0 kV
Insulation resistance: ≥10¹¹ Ω
Dielectric constant: 9.8 @1MHz
Circuit accuracy: ±25 μm
Pad coplanarity: ≤15 μm
Copper thickness: 30-100 μm adjustable
Operating temperature: -40℃～125℃
Thermal cycle performance: -40℃～85℃ ＞500 cycles
Moisture sensitivity: MSL Level 3
Indoor commercial lighting
Residential lighting sources
Industrial auxiliary lighting
Landscape decorative lighting
Emergency lighting systems
Special equipment indicator lights
Q: Can alumina substrate meet thermal requirements for medium-power LEDs?
A: For applications below 5W, alumina substrate's thermal performance is fully adequate with better cost advantage.
Q: Support for multi-chip integration?
A: Up to 4 LED chips can be integrated in 3.5×3.5mm size with various connection options.
Q: How about mass production stability?
A: Standardized DPC process ensures key parameters CPK≥1.33 for consistent batch quality.
Q: Customization service available?
A: Supports customization of pad size, circuit layout and surface treatment according to requirements.
Q: What is the product lifespan?
A: Product life exceeds 50,000 hours under rated operating conditions.
