65×45mm DPC Aluminum Nitride Ceramic Substrate - For High-Power UVA Curing Modules
This product is a high-performance planar LED ceramic substrate specifically designed for high-power ultraviolet curing modules. It utilizes high-thermal-conductivity aluminum nitride (AlN) ceramic as the base and employs the advanced Direct Plated Copper (DPC) process to create precise double-layer circuits over a large 65mm x 45mm area. It is designed to provide superior heat dissipation, reliable electrical connection, and stable mechanical support for high-density, high-power UVA LED chips, making it the ideal core component for next-generation efficient and long-life curing equipment.
Exceptional Thermal Management: AlN ceramic with high thermal conductivity (≥170 W/mK) rapidly dissipates heat from UVA LED chips, ensuring stable light output and significantly extended lifespan.
High Power Capacity: Thick copper circuits (up to 100μm) offer excellent current distribution, capable of handling power inputs of several hundred watts.
Precision Structure: DPC process enables high-precision circuit patterns (line width/spacing ≤50μm), supporting complex series/parallel chip layouts.
High Reliability: Strong metallurgical bond between copper and ceramic (adhesion ≥8MPa) and matched CTE ensure excellent performance under thermal cycling.
Excellent Insulation: High dielectric strength (≥15 kV/mm) of AlN ceramic ensures operational safety for high-power circuits.
Custom Design: Supports integration of features like temperature sensing points and driver pads for a tailored solution.
Industrial Printing & Coating
Electronics Assembly (Solder Mask, Adhesive Curing)
Automotive & Medical Device Assembly
Wood Finishing & Packaging
3D Printing
Q: Why choose AlN over standard MCPCB or Alumina for UVA modules?
A: AlN's superior thermal conductivity (5-8x that of Alumina) is crucial for managing the significant heat from high-power UVA LEDs, preventing performance decay and ensuring longevity, outperforming both MCPCBs (poor insulation) and Alumina.
Q: How is flatness ensured for this large 65*45mm substrate after LED mounting?
A: Optimized sintering and strict material control ensure excellent initial flatness (warpage typically <0.1%). Matched CTE minimizes thermal deformation during reflow, ensuring good contact with the heatsink.
Q: What are the advantages of DPC over Thick Film or DBC processes?
A: DPC offers superior circuit precision, lower thermal resistance due to direct bonding, and a flatter surface ideal for die attachment, leading to higher overall reliability.
Q: What is the maximum power rating for the UVA array on this substrate?
A: The power capacity depends on the circuit design and thermal solution. With efficient cooling, a single substrate can theoretically support total power exceeding 500W. Specific design requires evaluation based on client needs.
Q: Can an NTC thermistor be integrated for temperature monitoring?
A: Yes. We can create pads and traces for mounting an NTC thermistor directly onto the substrate via the DPC process, enabling real-time temperature monitoring.
65×45mm DPC Aluminum Nitride Ceramic Substrate - For High-Power UVA Curing Modules
This product is a high-performance planar LED ceramic substrate specifically designed for high-power ultraviolet curing modules. It utilizes high-thermal-conductivity aluminum nitride (AlN) ceramic as the base and employs the advanced Direct Plated Copper (DPC) process to create precise double-layer circuits over a large 65mm x 45mm area. It is designed to provide superior heat dissipation, reliable electrical connection, and stable mechanical support for high-density, high-power UVA LED chips, making it the ideal core component for next-generation efficient and long-life curing equipment.
Exceptional Thermal Management: AlN ceramic with high thermal conductivity (≥170 W/mK) rapidly dissipates heat from UVA LED chips, ensuring stable light output and significantly extended lifespan.
High Power Capacity: Thick copper circuits (up to 100μm) offer excellent current distribution, capable of handling power inputs of several hundred watts.
Precision Structure: DPC process enables high-precision circuit patterns (line width/spacing ≤50μm), supporting complex series/parallel chip layouts.
High Reliability: Strong metallurgical bond between copper and ceramic (adhesion ≥8MPa) and matched CTE ensure excellent performance under thermal cycling.
Excellent Insulation: High dielectric strength (≥15 kV/mm) of AlN ceramic ensures operational safety for high-power circuits.
Custom Design: Supports integration of features like temperature sensing points and driver pads for a tailored solution.
Industrial Printing & Coating
Electronics Assembly (Solder Mask, Adhesive Curing)
Automotive & Medical Device Assembly
Wood Finishing & Packaging
3D Printing
Q: Why choose AlN over standard MCPCB or Alumina for UVA modules?
A: AlN's superior thermal conductivity (5-8x that of Alumina) is crucial for managing the significant heat from high-power UVA LEDs, preventing performance decay and ensuring longevity, outperforming both MCPCBs (poor insulation) and Alumina.
Q: How is flatness ensured for this large 65*45mm substrate after LED mounting?
A: Optimized sintering and strict material control ensure excellent initial flatness (warpage typically <0.1%). Matched CTE minimizes thermal deformation during reflow, ensuring good contact with the heatsink.
Q: What are the advantages of DPC over Thick Film or DBC processes?
A: DPC offers superior circuit precision, lower thermal resistance due to direct bonding, and a flatter surface ideal for die attachment, leading to higher overall reliability.
Q: What is the maximum power rating for the UVA array on this substrate?
A: The power capacity depends on the circuit design and thermal solution. With efficient cooling, a single substrate can theoretically support total power exceeding 500W. Specific design requires evaluation based on client needs.
Q: Can an NTC thermistor be integrated for temperature monitoring?
A: Yes. We can create pads and traces for mounting an NTC thermistor directly onto the substrate via the DPC process, enabling real-time temperature monitoring.
