Solutions

The thermal expansion coefficient of ceramics is similar to that of chip materials.

The thermal expansion coefficient of ceramics is similar to that of semiconductor materials, which can reduce the stress caused by temperature changes and avoid package cracking or connection failure.

The thermal expansion coefficient of ceramics is similar to that of other materials used in TEC (such as semiconductor materials), which can reduce thermal stress caused by temperature changes and prevent material cracking or failure. Ceramic materials (such as alumina and aluminum nitride) have high thermal conductivity and can effectively conduct heat, ensuring efficient cooling or heating performance of TEC.

Adopt aluminum nitride ceramic substrate to effectively solve the problem of chip thermal conductivity.