1.Device:
▪Package Test
2.Industry:
▪Chip aging
3.Customer's pain point:
▪The expansion coefficient of FR4 material is quite different from that of the chip.
4.Current PCB technologies (with photos of our products):
▪Using DPC technology
5.Degree of problem solving:
▪The thermal expansion coefficient of ceramics is similar to that of chip materials.
6.Time to adopt new PCB:
▪2024
7.Total number of orders to date (approximate, may be exaggerated):
▪500K/month
