XRMK offers specialized packaging substrates for sensor modules, designed to provide superior protection and performance in high-demand applications. Our ceramic substrates for sensor modules are engineered using advanced packaging technologies, including DBC (Direct Bonded Copper) and AMB (Active Metal Brazing) processes, to ensure reliability, high thermal conductivity, and minimal signal interference. These substrates are ideal for applications in automotive sensors, industrial monitoring systems, and medical devices, where accurate data acquisition and protection are critical. XRMK’s sensor module packaging substrates are designed to meet the growing demand for compact, durable, and high-performance sensor systems, ensuring long-lasting reliability and operational stability in the most challenging environments.
Ceramics is in our company name, implying that ceramic-based circuit manufacturing is our focus service direction, including the use of DPC process, DBC process and AMB process, forming our full-service technical capabilities.
The introduction of thick film process and thin film process enables us to better adapt to the needs of special microelectronic products and realize the functionalization of circuit substrates.
