10×10mm DPC Alumina Ceramic Substrate - For High-Density Sensor Module Packaging
This product is a high-precision ceramic circuit board specifically designed for miniaturized sensor modules. Utilizing 99.6% high-purity alumina ceramic and advanced Direct Plated Copper technology, it achieves double-layer circuit routing within a compact 10×10mm size. The substrate offers excellent electrical performance, mechanical strength and thermal stability, providing a reliable miniaturized packaging solution for MEMS sensors, environmental sensors and biosensors, particularly suitable for space-constrained portable devices.
Miniaturized 10×10mm compact design
Fine circuit patterns with ≤40μm line width/spacing
Good thermal management with 24-28W/mK conductivity
Double-layer interconnection structure
High surface flatness (Ra≤0.05μm)
Stable electrical performance (εr=9.8@1MHz, tanδ≤0.0004)
MEMS inertial and pressure sensors
Miniature environmental monitoring modules
Wearable biosensors
Micro optical sensor packaging
Industrial IoT sensing nodes
Portable medical detection probes
Q: What is the minimum chip size supported?
A: Supports 0201 and larger components, minimum chip size 0.6×0.3mm.
Q: How about reliability in humid environments?
A: Excellent moisture resistance, stable operation at 85% RH with proper encapsulation.
Q: Are blind vias supported?
A: Laser drilling enables 0.1mm diameter micro vias for interlayer connection.
Q: What is the maximum current capacity?
A: Power lines can carry up to 5A continuous current depending on line width.
Q: What is the operating temperature range?
A: Standard range -55℃ to 250℃, suitable for most sensor applications.
10×10mm DPC Alumina Ceramic Substrate - For High-Density Sensor Module Packaging
This product is a high-precision ceramic circuit board specifically designed for miniaturized sensor modules. Utilizing 99.6% high-purity alumina ceramic and advanced Direct Plated Copper technology, it achieves double-layer circuit routing within a compact 10×10mm size. The substrate offers excellent electrical performance, mechanical strength and thermal stability, providing a reliable miniaturized packaging solution for MEMS sensors, environmental sensors and biosensors, particularly suitable for space-constrained portable devices.
Miniaturized 10×10mm compact design
Fine circuit patterns with ≤40μm line width/spacing
Good thermal management with 24-28W/mK conductivity
Double-layer interconnection structure
High surface flatness (Ra≤0.05μm)
Stable electrical performance (εr=9.8@1MHz, tanδ≤0.0004)
MEMS inertial and pressure sensors
Miniature environmental monitoring modules
Wearable biosensors
Micro optical sensor packaging
Industrial IoT sensing nodes
Portable medical detection probes
Q: What is the minimum chip size supported?
A: Supports 0201 and larger components, minimum chip size 0.6×0.3mm.
Q: How about reliability in humid environments?
A: Excellent moisture resistance, stable operation at 85% RH with proper encapsulation.
Q: Are blind vias supported?
A: Laser drilling enables 0.1mm diameter micro vias for interlayer connection.
Q: What is the maximum current capacity?
A: Power lines can carry up to 5A continuous current depending on line width.
Q: What is the operating temperature range?
A: Standard range -55℃ to 250℃, suitable for most sensor applications.
