15mm Diameter DPC Aluminum Nitride Ceramic Substrate - For Sensor Module Packaging
This product is a circular ceramic circuit board specifically designed for high-end sensor module packaging. Utilizing aluminum nitride ceramic material and Direct Plated Copper technology, it achieves precise double-layer wiring within a 15mm diameter circular area. The substrate offers excellent thermal management and high-frequency characteristics, providing a stable and reliable packaging platform for temperature, pressure, optical and other sensitive sensors.
Optimized circular design with 15mm diameter
Superior thermal conductivity (170-200 W/mK)
Precision DPC process with 30μm line width/spacing
Double-layer wiring structure
Excellent high-frequency performance
High reliability packaging solution
High precision temperature sensors
MEMS pressure sensors
Optical sensor modules
Aerospace sensor systems
Automotive electronic sensors
Industrial control sensors
Q: Why is AlN recommended for sensor modules?
A: AlN offers high thermal conductivity, low CTE and excellent insulation for protecting sensitive sensing elements.
Q: Can circular substrate achieve high-density wiring?
A: DPC process enables 30μm line width in circular area for most sensor applications.
Q: What is the operating temperature range?
A: Standard range from -55℃ to 300℃ suits most demanding environments.
Q: Are special pad treatments available?
A: Gold plating, ENIG and other surface treatments support wire bonding and chip mounting.
Q: What are the minimum hole and pad sizes?
A: Minimum hole size 0.1mm, minimum pad diameter 0.2mm, customizable per requirements.
15mm Diameter DPC Aluminum Nitride Ceramic Substrate - For Sensor Module Packaging
This product is a circular ceramic circuit board specifically designed for high-end sensor module packaging. Utilizing aluminum nitride ceramic material and Direct Plated Copper technology, it achieves precise double-layer wiring within a 15mm diameter circular area. The substrate offers excellent thermal management and high-frequency characteristics, providing a stable and reliable packaging platform for temperature, pressure, optical and other sensitive sensors.
Optimized circular design with 15mm diameter
Superior thermal conductivity (170-200 W/mK)
Precision DPC process with 30μm line width/spacing
Double-layer wiring structure
Excellent high-frequency performance
High reliability packaging solution
High precision temperature sensors
MEMS pressure sensors
Optical sensor modules
Aerospace sensor systems
Automotive electronic sensors
Industrial control sensors
Q: Why is AlN recommended for sensor modules?
A: AlN offers high thermal conductivity, low CTE and excellent insulation for protecting sensitive sensing elements.
Q: Can circular substrate achieve high-density wiring?
A: DPC process enables 30μm line width in circular area for most sensor applications.
Q: What is the operating temperature range?
A: Standard range from -55℃ to 300℃ suits most demanding environments.
Q: Are special pad treatments available?
A: Gold plating, ENIG and other surface treatments support wire bonding and chip mounting.
Q: What are the minimum hole and pad sizes?
A: Minimum hole size 0.1mm, minimum pad diameter 0.2mm, customizable per requirements.
