25×30mm DPC Alumina Ceramic Substrate - For High Performance Pressure Sensor Packaging
This product is a ceramic packaging substrate specifically designed for industrial-grade pressure sensors. Utilizing high-purity alumina ceramic and Direct Plated Copper technology, it achieves precise double-layer circuits within an optimized 25×30mm size. The substrate features excellent mechanical strength, thermal stability, and sealing capability, providing reliable stress transfer and electrical connections for piezoresistive, capacitive and other pressure sensors.
Superior mechanical strength (flexural strength ≥300MPa)
Precision electrode design (line width/spacing ≤50μm)
Optimized thermal management (thermal conductivity 25W/(m·K))
Stable dielectric properties (εr=9.8, dielectric strength ≥15kV/mm)
Reliable sealing structure supporting various sealing methods
Multi-layer interconnection capability
Automotive manifold pressure sensing
Industrial process control pressure transmitters
Medical equipment pressure monitoring
HVAC system pressure control
Hydraulic/pneumatic system pressure sensing
Aerospace pressure measurement units
Q: Does the substrate meet automotive temperature cycling requirements?
A: Yes, it passes 1000+ cycles from -40℃ to 125℃, compliant with AEC-Q200.
Q: Is it suitable for direct pressure port mounting?
A: Yes, the design includes mechanical fixation features for pressure ports.
Q: How is signal output stability ensured?
A: Optimized layout and grounding provide >60dB signal-to-noise ratio.
Q: Does it support multiple pressure sensing technologies?
A: Supports piezoresistive, capacitive, resonant technologies, etc.
Q: How about mass production consistency?
A: Automated DPC process ensures ±5% tolerance on key parameters.
25×30mm DPC Alumina Ceramic Substrate - For High Performance Pressure Sensor Packaging
This product is a ceramic packaging substrate specifically designed for industrial-grade pressure sensors. Utilizing high-purity alumina ceramic and Direct Plated Copper technology, it achieves precise double-layer circuits within an optimized 25×30mm size. The substrate features excellent mechanical strength, thermal stability, and sealing capability, providing reliable stress transfer and electrical connections for piezoresistive, capacitive and other pressure sensors.
Superior mechanical strength (flexural strength ≥300MPa)
Precision electrode design (line width/spacing ≤50μm)
Optimized thermal management (thermal conductivity 25W/(m·K))
Stable dielectric properties (εr=9.8, dielectric strength ≥15kV/mm)
Reliable sealing structure supporting various sealing methods
Multi-layer interconnection capability
Automotive manifold pressure sensing
Industrial process control pressure transmitters
Medical equipment pressure monitoring
HVAC system pressure control
Hydraulic/pneumatic system pressure sensing
Aerospace pressure measurement units
Q: Does the substrate meet automotive temperature cycling requirements?
A: Yes, it passes 1000+ cycles from -40℃ to 125℃, compliant with AEC-Q200.
Q: Is it suitable for direct pressure port mounting?
A: Yes, the design includes mechanical fixation features for pressure ports.
Q: How is signal output stability ensured?
A: Optimized layout and grounding provide >60dB signal-to-noise ratio.
Q: Does it support multiple pressure sensing technologies?
A: Supports piezoresistive, capacitive, resonant technologies, etc.
Q: How about mass production consistency?
A: Automated DPC process ensures ±5% tolerance on key parameters.
