XRMK’s high-power packaging substrates are engineered to meet the stringent requirements of power electronics, providing robust solutions for high-voltage and high-current applications. Our ceramic substrates are designed to withstand extreme thermal and electrical stresses, ensuring optimal performance and long-term reliability in power modules, inverters, and motor drives. We utilize the DBC (Direct Bonded Copper) process to create highly durable substrates that offer excellent thermal management and high electrical conductivity. XRMK’s high-power packaging substrates are ideal for applications in electric vehicles, renewable energy systems, and industrial power conversion, where efficiency, heat resistance, and performance are paramount.
Ceramics is in our company name, implying that ceramic-based circuit manufacturing is our focus service direction, including the use of DPC process, DBC process and AMB process, forming our full-service technical capabilities.
The introduction of thick film process and thin film process enables us to better adapt to the needs of special microelectronic products and realize the functionalization of circuit substrates.
