30×45mm DPC Alumina Ceramic Substrate - For High Power Module Packaging
This product is a high-performance ceramic circuit board specifically designed for high-power electronic modules. Using high-purity alumina ceramic substrate and Direct Plated Copper technology, it achieves double-layer circuit routing within a large 30×45mm area. The substrate offers excellent thermal management capability, high insulation strength and outstanding mechanical stability, providing a reliable platform for heat dissipation and electrical connections for IGBT, SiC, GaN and other power devices.
Thermal conductivity ≥ 24 W/(m·K)
Supports power density ≥ 30 W/cm²
Copper thickness up to 300 μm
Continuous current capacity ≥ 50 A
Dielectric strength ≥ 15 kV/mm
Volume resistivity ≥ 10¹⁴ Ω·cm
Flexural strength ≥ 300 MPa
CTE 6.5-8.0 ppm/℃
Min. line width/spacing: 100 μm
Layer alignment accuracy: ±25 μm
Industrial motor drive modules
New energy vehicle control systems
Photovoltaic/wind power converters
High power supply modules
Rail transit traction systems
Special power equipment
Q: What is the maximum operating temperature?
A: The substrate can operate stably from -55℃ to 300℃, with short-term capability up to 350℃.
Q: How to ensure reliability under high current?
A: Thick copper design (up to 300μm), optimized layout and welding process ensure long-term reliability.
Q: Is 3D packaging structure supported?
A: Yes, multi-layer substrate stacking enables 3D packaging for higher power density.
Q: How about moisture resistance?
A: Alumina ceramic has excellent moisture resistance, suitable for long-term operation at 85% RH.
Q: What is the lead time for customization?
A: Standard products: 2-3 weeks; Customized development: 4-6 weeks, depending on technical complexity.
30×45mm DPC Alumina Ceramic Substrate - For High Power Module Packaging
This product is a high-performance ceramic circuit board specifically designed for high-power electronic modules. Using high-purity alumina ceramic substrate and Direct Plated Copper technology, it achieves double-layer circuit routing within a large 30×45mm area. The substrate offers excellent thermal management capability, high insulation strength and outstanding mechanical stability, providing a reliable platform for heat dissipation and electrical connections for IGBT, SiC, GaN and other power devices.
Thermal conductivity ≥ 24 W/(m·K)
Supports power density ≥ 30 W/cm²
Copper thickness up to 300 μm
Continuous current capacity ≥ 50 A
Dielectric strength ≥ 15 kV/mm
Volume resistivity ≥ 10¹⁴ Ω·cm
Flexural strength ≥ 300 MPa
CTE 6.5-8.0 ppm/℃
Min. line width/spacing: 100 μm
Layer alignment accuracy: ±25 μm
Industrial motor drive modules
New energy vehicle control systems
Photovoltaic/wind power converters
High power supply modules
Rail transit traction systems
Special power equipment
Q: What is the maximum operating temperature?
A: The substrate can operate stably from -55℃ to 300℃, with short-term capability up to 350℃.
Q: How to ensure reliability under high current?
A: Thick copper design (up to 300μm), optimized layout and welding process ensure long-term reliability.
Q: Is 3D packaging structure supported?
A: Yes, multi-layer substrate stacking enables 3D packaging for higher power density.
Q: How about moisture resistance?
A: Alumina ceramic has excellent moisture resistance, suitable for long-term operation at 85% RH.
Q: What is the lead time for customization?
A: Standard products: 2-3 weeks; Customized development: 4-6 weeks, depending on technical complexity.
