1.Device:
▪Optical Module
2.Industry:
▪Thermoelectric Cooler (TEC)
3.Customer's pain point:
▪Insufficient heat conduction.
4.Current PCB technologies (with photos of our products):
▪Using DPC technology
5.Degree of problem solving:
▪The thermal expansion coefficient of ceramics is similar to that of other materials used in TEC (such as semiconductor materials), which can reduce thermal stress caused by temperature changes and prevent material cracking or failure. Ceramic materials (such as alumina and aluminum nitride) have high thermal conductivity and can effectively conduct heat, ensuring efficient cooling or heating performance of TEC.
6.Time to adopt new PCB:
▪2023
7.Total number of orders to date (approximate, may be exaggerated):
▪800K/month
