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18×12mm DPC Alumina Ceramic Substrate - For Multi-functional Sensor Module Packaging
This product is a double-layer ceramic circuit board designed for medium-sized sensor modules. Using 96% alumina ceramic substrate and Direct Plated Copper technology, it achieves high-density circuit routing within an optimized 18×12mm size. The substrate provides the ideal balance between thermal management, mechanical strength and circuit complexity, offering a reliable packaging platform for industrial sensors, environmental monitoring modules and IoT sensing terminals.
Optimized 18×12mm rectangular dimensions
High-density interconnects with ≤50μm line/space
Good thermal performance (25W/mK)
Enhanced mechanical strength (flexural strength ≥300MPa)
Precise alignment accuracy (±15μm)
Diverse surface treatment options
Industrial process control sensors
Smart home environmental sensing
Automotive electronic control units
Agricultural IoT monitoring nodes
Energy management system sensors
Security monitoring sensor modules
Q: What sensors are suitable for this substrate size?
A: Suitable for integrating temperature, humidity, pressure, gas, light sensors and signal conditioning circuits.
Q: How about reliability in vibration environments?
A: Withstands 10-2000Hz vibration due to high mechanical strength and strong bonding.
Q: Is impedance control supported?
A: Yes, ±10% impedance control accuracy available for high-frequency signals.
Q: Maximum number of I/Os supported?
A: Up to 48 I/Os in double-layer design for medium complexity sensors.
Q: What is the mass production lead time?
A: Standard lead time is 2-3 weeks, expedited service available.
18×12mm DPC Alumina Ceramic Substrate - For Multi-functional Sensor Module Packaging
This product is a double-layer ceramic circuit board designed for medium-sized sensor modules. Using 96% alumina ceramic substrate and Direct Plated Copper technology, it achieves high-density circuit routing within an optimized 18×12mm size. The substrate provides the ideal balance between thermal management, mechanical strength and circuit complexity, offering a reliable packaging platform for industrial sensors, environmental monitoring modules and IoT sensing terminals.
Optimized 18×12mm rectangular dimensions
High-density interconnects with ≤50μm line/space
Good thermal performance (25W/mK)
Enhanced mechanical strength (flexural strength ≥300MPa)
Precise alignment accuracy (±15μm)
Diverse surface treatment options
Industrial process control sensors
Smart home environmental sensing
Automotive electronic control units
Agricultural IoT monitoring nodes
Energy management system sensors
Security monitoring sensor modules
Q: What sensors are suitable for this substrate size?
A: Suitable for integrating temperature, humidity, pressure, gas, light sensors and signal conditioning circuits.
Q: How about reliability in vibration environments?
A: Withstands 10-2000Hz vibration due to high mechanical strength and strong bonding.
Q: Is impedance control supported?
A: Yes, ±10% impedance control accuracy available for high-frequency signals.
Q: Maximum number of I/Os supported?
A: Up to 48 I/Os in double-layer design for medium complexity sensors.
Q: What is the mass production lead time?
A: Standard lead time is 2-3 weeks, expedited service available.
