1.Device:
▪Package Test
2.Industry:
▪Chip testing
3.Customer's pain point:
▪The expansion coefficient of FR4 material is quite different from that of the chip.
4.Current PCB technologies (with photos of our products):
▪Using DPC technology
5.Degree of problem solving:
▪The thermal expansion coefficient of ceramics is similar to that of semiconductor materials, which can reduce the stress caused by temperature changes and avoid package cracking or connection failure.
6.Time to adopt new PCB:
▪2023
7.Total number of orders to date (approximate, may be exaggerated):
▪1000pcs/month
