3.5×7mm DPC Aluminum Nitride Ceramic Substrate - For LED Automotive Headlights
This product is a high-reliability ceramic substrate specifically designed for LED automotive headlights. Utilizing aluminum nitride ceramic substrate and Direct Plated Copper technology, it achieves precise double-layer wiring within an optimized 3.5×7mm size. The product offers exceptional heat dissipation performance, excellent mechanical strength and stable electrical characteristics, meeting the stringent requirements of automotive LED headlights for high temperature, high humidity and vibration resistance.
Thermal conductivity: ≥180 W/(m·K)
Thermal resistance: ＜3 K/W
Operating temperature: -40℃～150℃
Withstand voltage: ≥2.5 kV
Dielectric constant: 8.6 @1MHz
Insulation resistance: ≥10¹² Ω
Circuit accuracy: ±20 μm
Pad flatness: ≤10 μm
Copper thickness: 50-200 μm adjustable
Passes 2000 thermal cycles (-40℃↔125℃)
Vibration resistance: 20-2000Hz/50g
Anti-sulfuration level: Level 1
Automotive headlight low beam modules
Daytime running light modules
Fog lamp lighting systems
Turn signal lights
High-mounted stop lamps
Special vehicle lighting systems
Q: Does the product meet automotive reliability standards?
A: Fully compliant with AEC-Q200, passing rigorous temperature cycling, mechanical shock, and vibration tests.
Q: How to ensure reliability in vibration environments?
A: High-strength AlN substrate (flexural strength ≥320MPa) combined with strong DPC bonding (≥8MPa) ensures stability.
Q: Support for high current drive?
A: Supports up to 5A continuous current with maximum 200μm copper thickness.
Q: Can temperature protection be integrated?
A: NTC thermistor mounting positions can be designed on substrate for real-time monitoring.
Q: How to ensure mass production consistency?
A: Automated DPC production line ensures key parameters CPK≥1.67 for consistent quality.
3.5×7mm DPC Aluminum Nitride Ceramic Substrate - For LED Automotive Headlights
This product is a high-reliability ceramic substrate specifically designed for LED automotive headlights. Utilizing aluminum nitride ceramic substrate and Direct Plated Copper technology, it achieves precise double-layer wiring within an optimized 3.5×7mm size. The product offers exceptional heat dissipation performance, excellent mechanical strength and stable electrical characteristics, meeting the stringent requirements of automotive LED headlights for high temperature, high humidity and vibration resistance.
Thermal conductivity: ≥180 W/(m·K)
Thermal resistance: ＜3 K/W
Operating temperature: -40℃～150℃
Withstand voltage: ≥2.5 kV
Dielectric constant: 8.6 @1MHz
Insulation resistance: ≥10¹² Ω
Circuit accuracy: ±20 μm
Pad flatness: ≤10 μm
Copper thickness: 50-200 μm adjustable
Passes 2000 thermal cycles (-40℃↔125℃)
Vibration resistance: 20-2000Hz/50g
Anti-sulfuration level: Level 1
Automotive headlight low beam modules
Daytime running light modules
Fog lamp lighting systems
Turn signal lights
High-mounted stop lamps
Special vehicle lighting systems
Q: Does the product meet automotive reliability standards?
A: Fully compliant with AEC-Q200, passing rigorous temperature cycling, mechanical shock, and vibration tests.
Q: How to ensure reliability in vibration environments?
A: High-strength AlN substrate (flexural strength ≥320MPa) combined with strong DPC bonding (≥8MPa) ensures stability.
Q: Support for high current drive?
A: Supports up to 5A continuous current with maximum 200μm copper thickness.
Q: Can temperature protection be integrated?
A: NTC thermistor mounting positions can be designed on substrate for real-time monitoring.
Q: How to ensure mass production consistency?
A: Automated DPC production line ensures key parameters CPK≥1.67 for consistent quality.
