2×1.6mm DPC Aluminum Nitride Ceramic Substrate - For Micro LED Lighting Devices
This product is an ultra-miniature ceramic substrate specifically designed for micro LED lighting applications. Using aluminum nitride ceramic material and Direct Plated Copper technology, it achieves precise double-layer circuit structure within a 2×1.6mm micro size. The product offers excellent thermal management capability and stable electrical performance, providing ideal heat dissipation and electrical connection solution for high power density LED chips, particularly suitable for space-constrained miniaturized lighting applications.
Dimension: 2.0×1.6mm
Thickness range: 0.2-0.4mm
Weight: <20mg
Thermal conductivity: 170-200 W/(m·K)
Thermal resistance: <5 K/W
Maximum power capacity: 3W
Line accuracy: ±15μm
Insulation resistance: ≥10^12 Ω
Breakdown voltage: ≥2.5kV
Flexural strength: ≥300MPa
CTE: 4.5-5.0 ppm/℃
Surface roughness: Ra≤0.1μm
Miniature projector light source modules
Endoscopic medical illumination
Portable device flash lights
High-density array lighting modules
Precision instrument indicator lights
Micro optical sensing equipment
Q: How to ensure welding yield with such small size?
A: Using precision solder paste printing and vacuum reflow process with dedicated fixtures can improve welding yield to over 99.5%.
Q: Support for multi-chip integration?
A: Up to 4 LED chips can be integrated in 2×1.6mm size, supporting series/parallel connections.
Q: How to verify thermal performance?
A: Verified by IR thermal imaging and thermocouple testing to ensure junction temperature within safe range.
Q: Tape and reel packaging available?
A: Support 8mm carrier width tape and reel packaging for automated placement.
Q: What is the minimum order quantity?
A: Standard product MOQ is 10K, samples available according to requirements.
2×1.6mm DPC Aluminum Nitride Ceramic Substrate - For Micro LED Lighting Devices
This product is an ultra-miniature ceramic substrate specifically designed for micro LED lighting applications. Using aluminum nitride ceramic material and Direct Plated Copper technology, it achieves precise double-layer circuit structure within a 2×1.6mm micro size. The product offers excellent thermal management capability and stable electrical performance, providing ideal heat dissipation and electrical connection solution for high power density LED chips, particularly suitable for space-constrained miniaturized lighting applications.
Dimension: 2.0×1.6mm
Thickness range: 0.2-0.4mm
Weight: <20mg
Thermal conductivity: 170-200 W/(m·K)
Thermal resistance: <5 K/W
Maximum power capacity: 3W
Line accuracy: ±15μm
Insulation resistance: ≥10^12 Ω
Breakdown voltage: ≥2.5kV
Flexural strength: ≥300MPa
CTE: 4.5-5.0 ppm/℃
Surface roughness: Ra≤0.1μm
Miniature projector light source modules
Endoscopic medical illumination
Portable device flash lights
High-density array lighting modules
Precision instrument indicator lights
Micro optical sensing equipment
Q: How to ensure welding yield with such small size?
A: Using precision solder paste printing and vacuum reflow process with dedicated fixtures can improve welding yield to over 99.5%.
Q: Support for multi-chip integration?
A: Up to 4 LED chips can be integrated in 2×1.6mm size, supporting series/parallel connections.
Q: How to verify thermal performance?
A: Verified by IR thermal imaging and thermocouple testing to ensure junction temperature within safe range.
Q: Tape and reel packaging available?
A: Support 8mm carrier width tape and reel packaging for automated placement.
Q: What is the minimum order quantity?
A: Standard product MOQ is 10K, samples available according to requirements.
