This product is a 3.5×3.5mm aluminum nitride ceramic packaging substrate specifically designed for high-end LED lighting applications. Manufactured using advanced DPC (Direct Plated Copper) technology, it offers exceptional thermal conductivity and stable electrical characteristics, providing a reliable packaging solution for high-power LED lighting. The precise double-layer circuit design supports complex layouts, meeting the demands for high performance and miniaturization in modern lighting systems.
Product Features
1. Superior Thermal Management
AlN ceramic substrate with ≥170 W/mK thermal conductivity
A1: The core advantage is the combination of AlN material and DPC process, achieving excellent thermal conductivity and precise circuit fabrication, especially suitable for high-power LED packaging.
Q2: Can the substrate withstand reflow process?
A2: Yes, it withstands over 3 cycles of 260℃ lead-free reflow soldering without pad oxidation or deformation.
Q3: Is customization available?
A3: We offer customization services including pad size and circuit layout adjustments per customer requirements.
A5: 15-20 days for standard products, 25-30 days for customized products.
Product Overview
This product is a 3.5×3.5mm aluminum nitride ceramic packaging substrate specifically designed for high-end LED lighting applications. Manufactured using advanced DPC (Direct Plated Copper) technology, it offers exceptional thermal conductivity and stable electrical characteristics, providing a reliable packaging solution for high-power LED lighting. The precise double-layer circuit design supports complex layouts, meeting the demands for high performance and miniaturization in modern lighting systems.
Product Features
1. Superior Thermal Management
AlN ceramic substrate with ≥170 W/mK thermal conductivity
A1: The core advantage is the combination of AlN material and DPC process, achieving excellent thermal conductivity and precise circuit fabrication, especially suitable for high-power LED packaging.
Q2: Can the substrate withstand reflow process?
A2: Yes, it withstands over 3 cycles of 260℃ lead-free reflow soldering without pad oxidation or deformation.
Q3: Is customization available?
A3: We offer customization services including pad size and circuit layout adjustments per customer requirements.
