25×75mm Thick Film Alumina Ceramic Substrate - For Power Modules
This product is a single-layer power circuit substrate manufactured using advanced thick film technology on 25×75mm high-purity alumina ceramic. Through screen printing and high-temperature sintering processes, highly reliable conductive circuits and power resistors are formed on the substrate, specifically designed for high-power, high-voltage applications with excellent thermal cycling performance and electrical stability.
Continuous working voltage: ≥3000 VDC
Peak pulse power: ≥50 kW
Maximum current capacity: 100 A
Thermal conductivity: 24 W/(m·K)
Maximum operating temperature: 450℃
CTE: 6.8 ppm/℃
Conductor thickness: 10-20 μm
Sheet resistance range: 10 mΩ/□ - 1 MΩ/□
Resistance tolerance: ±1% (after laser trimming)
Flexural strength: 350 MPa
Surface roughness: Ra ≤ 0.4 μm
Substrate thickness: 0.63 mm/1.0 mm
Industrial motor drive power modules
New energy vehicle control systems
Photovoltaic inverter power units
Rail transit traction modules
Induction heating power systems
High-power power converters
Q: Advantages of thick film vs DPC process?
A: Thick film offers higher voltage withstand, better thermal cycling performance and lower manufacturing cost.
Q: Achievable resistor power density?
A: Thick film resistors reach 30 W/cm², further improved with proper thermal design.
Q: Support for multi-layer routing?
A: Single-layer design, but simple double-layer interconnection possible via dielectric printing.
Q: Environmental adaptability?
A: Passes 1000 cycles of -40℃ to 150℃ thermal cycling, meeting automotive-grade reliability.
Q: Custom development lead time?
A: 2-3 weeks for standard process, 4-5 weeks for new designs.
25×75mm Thick Film Alumina Ceramic Substrate - For Power Modules
This product is a single-layer power circuit substrate manufactured using advanced thick film technology on 25×75mm high-purity alumina ceramic. Through screen printing and high-temperature sintering processes, highly reliable conductive circuits and power resistors are formed on the substrate, specifically designed for high-power, high-voltage applications with excellent thermal cycling performance and electrical stability.
Continuous working voltage: ≥3000 VDC
Peak pulse power: ≥50 kW
Maximum current capacity: 100 A
Thermal conductivity: 24 W/(m·K)
Maximum operating temperature: 450℃
CTE: 6.8 ppm/℃
Conductor thickness: 10-20 μm
Sheet resistance range: 10 mΩ/□ - 1 MΩ/□
Resistance tolerance: ±1% (after laser trimming)
Flexural strength: 350 MPa
Surface roughness: Ra ≤ 0.4 μm
Substrate thickness: 0.63 mm/1.0 mm
Industrial motor drive power modules
New energy vehicle control systems
Photovoltaic inverter power units
Rail transit traction modules
Induction heating power systems
High-power power converters
Q: Advantages of thick film vs DPC process?
A: Thick film offers higher voltage withstand, better thermal cycling performance and lower manufacturing cost.
Q: Achievable resistor power density?
A: Thick film resistors reach 30 W/cm², further improved with proper thermal design.
Q: Support for multi-layer routing?
A: Single-layer design, but simple double-layer interconnection possible via dielectric printing.
Q: Environmental adaptability?
A: Passes 1000 cycles of -40℃ to 150℃ thermal cycling, meeting automotive-grade reliability.
Q: Custom development lead time?
A: 2-3 weeks for standard process, 4-5 weeks for new designs.
