30×30mm DPC Thick Film Alumina Ceramic Substrate - For High Precision Sensor Modules
This product utilizes direct plated copper technology to achieve thick film integrated circuits on 30×30mm alumina ceramic substrate, specifically designed for high precision sensor modules. Through double-layer DPC process, it realizes precise circuit routing, combining the stability of thick film resistors and excellent characteristics of ceramic substrate to provide highly reliable signal processing and transmission platform for various sensors.
Line width/spacing: ≤50μm
Interlayer alignment accuracy: ±15μm
Resistance tolerance: ±0.5% (after laser trimming)
Thermal conductivity: 24 W/(m·K)
Operating temperature range: -55℃～200℃
CTE: 6.5 ppm/℃
Insulation resistance: ≥10^12 Ω
Dielectric strength: ≥15 kV/mm
TCR: ±50 ppm/℃
Substrate thickness: 0.38 mm/0.63 mm
Flexural strength: 300 MPa
Surface flatness: ≤10 μm/in
Industrial pressure sensor modules
High precision temperature sensing systems
Automotive electronic sensor control units
Medical equipment sensing detection modules
Environmental monitoring sensor nodes
Aerospace sensing systems
Q: Advantages of DPC thick film vs traditional thick film?
A: DPC offers higher circuit precision, better thermal conductivity and superior interlayer adhesion.
Q: Support for multi-type sensor integration?
A: Supports integration of temperature, pressure, humidity, gas sensors with complex signal processing.
Q: Long-term stability of resistors?
A: Annual resistance change rate <0.1% after laser trimming and aging treatment.
Q: Environmental adaptability?
A: Passes 85℃/85%RH 1000h test, meeting industrial environment reliability requirements.
Q: Customization lead time?
A: Standard products 2-3 weeks, custom development 3-4 weeks based on complexity.
30×30mm DPC Thick Film Alumina Ceramic Substrate - For High Precision Sensor Modules
This product utilizes direct plated copper technology to achieve thick film integrated circuits on 30×30mm alumina ceramic substrate, specifically designed for high precision sensor modules. Through double-layer DPC process, it realizes precise circuit routing, combining the stability of thick film resistors and excellent characteristics of ceramic substrate to provide highly reliable signal processing and transmission platform for various sensors.
Line width/spacing: ≤50μm
Interlayer alignment accuracy: ±15μm
Resistance tolerance: ±0.5% (after laser trimming)
Thermal conductivity: 24 W/(m·K)
Operating temperature range: -55℃～200℃
CTE: 6.5 ppm/℃
Insulation resistance: ≥10^12 Ω
Dielectric strength: ≥15 kV/mm
TCR: ±50 ppm/℃
Substrate thickness: 0.38 mm/0.63 mm
Flexural strength: 300 MPa
Surface flatness: ≤10 μm/in
Industrial pressure sensor modules
High precision temperature sensing systems
Automotive electronic sensor control units
Medical equipment sensing detection modules
Environmental monitoring sensor nodes
Aerospace sensing systems
Q: Advantages of DPC thick film vs traditional thick film?
A: DPC offers higher circuit precision, better thermal conductivity and superior interlayer adhesion.
Q: Support for multi-type sensor integration?
A: Supports integration of temperature, pressure, humidity, gas sensors with complex signal processing.
Q: Long-term stability of resistors?
A: Annual resistance change rate <0.1% after laser trimming and aging treatment.
Q: Environmental adaptability?
A: Passes 85℃/85%RH 1000h test, meeting industrial environment reliability requirements.
Q: Customization lead time?
A: Standard products 2-3 weeks, custom development 3-4 weeks based on complexity.
