21×15mm DPC Alumina Ceramic Substrate - For Thermoelectric Coolers (TEC)
This product is a high-performance ceramic circuit board specifically optimized for semiconductor thermoelectric coolers. Utilizing high-purity alumina ceramic substrate and advanced Direct Plated Copper technology, it achieves precise circuit patterns with optimal balance between thermal conductivity, electrical insulation, and mechanical strength. The unique rectangular size design meets special spatial layout requirements, making it an ideal choice for compact temperature control devices.
Optimized thermal management with good thermal conductivity (24-28 W/mK)
Precision DPC process enables fine circuit patterns with line width/spacing ≤50μm
Special 21×15mm rectangular size for enhanced design flexibility
Double-layer wiring structure supports complex circuit designs
High reliability with strong ceramic-metal bonding strength
Excellent insulation performance (breakdown voltage ≥10 kV/mm)
Miniature TEC temperature control modules
Medical detection instrument temperature control systems
Laser temperature control in optical communication equipment
Industrial sensor temperature stabilization devices
Laboratory precision instrument temperature control systems
Automotive electronic control unit cooling
Q: Is alumina substrate suitable for high-power TEC applications?
A: This substrate is suitable for medium and low power density TEC applications, supporting up to 15A continuous current at 21×15mm size.
Q: What is the dimensional tolerance of the substrate?
A: Standard dimensional tolerance is ±0.1mm, with more precise processing available upon request.
Q: Are special surface treatments supported?
A: Yes, various surface treatments including gold plating and nickel plating are available.
Q: How is the warpage control?
A: Special process control ensures warpage ≤0.5%, guaranteeing mounting accuracy.
Q: What is the maximum operating temperature?
A: The substrate can operate stably within -55℃ to 300℃ temperature range.
21×15mm DPC Alumina Ceramic Substrate - For Thermoelectric Coolers (TEC)
This product is a high-performance ceramic circuit board specifically optimized for semiconductor thermoelectric coolers. Utilizing high-purity alumina ceramic substrate and advanced Direct Plated Copper technology, it achieves precise circuit patterns with optimal balance between thermal conductivity, electrical insulation, and mechanical strength. The unique rectangular size design meets special spatial layout requirements, making it an ideal choice for compact temperature control devices.
Optimized thermal management with good thermal conductivity (24-28 W/mK)
Precision DPC process enables fine circuit patterns with line width/spacing ≤50μm
Special 21×15mm rectangular size for enhanced design flexibility
Double-layer wiring structure supports complex circuit designs
High reliability with strong ceramic-metal bonding strength
Excellent insulation performance (breakdown voltage ≥10 kV/mm)
Miniature TEC temperature control modules
Medical detection instrument temperature control systems
Laser temperature control in optical communication equipment
Industrial sensor temperature stabilization devices
Laboratory precision instrument temperature control systems
Automotive electronic control unit cooling
Q: Is alumina substrate suitable for high-power TEC applications?
A: This substrate is suitable for medium and low power density TEC applications, supporting up to 15A continuous current at 21×15mm size.
Q: What is the dimensional tolerance of the substrate?
A: Standard dimensional tolerance is ±0.1mm, with more precise processing available upon request.
Q: Are special surface treatments supported?
A: Yes, various surface treatments including gold plating and nickel plating are available.
Q: How is the warpage control?
A: Special process control ensures warpage ≤0.5%, guaranteeing mounting accuracy.
Q: What is the maximum operating temperature?
A: The substrate can operate stably within -55℃ to 300℃ temperature range.
