15×40mm DBC Alumina Ceramic Substrate - For Thermoelectric Coolers (TTC)
This product features a direct bonded copper alumina ceramic substrate specifically designed for elongated TEC modules. The high-temperature process creates strong bonding between copper and ceramic layers, offering excellent current carrying capacity and heat dissipation performance. The unique 15×40mm rectangular size is particularly suitable for TEC applications requiring linear heat flow management.
High current capacity with copper thickness up to 300μm
Good thermal conductivity (24-28 W/mK)
Strong bonding strength ≥20 N/mm²
Single-layer optimized design for cost-effectiveness
Elongated structure ideal for linearly arranged TEC arrays
High reliability with over 1000 thermal cycles endurance
Elongated TEC cooling modules
Industrial linear temperature control systems
Medical analyzer temperature control components
Communication cabinet local cooling
Laboratory platform temperature control
Power electronics thermal management
Q: What are the main differences between DBC and DPC processes?
A: DBC bonds copper foil to ceramic at high temperature with thicker copper layers for high current applications; DPC deposits copper through plating for finer circuits.
Q: Can single-layer substrate meet complex TEC circuit requirements?
A: This single-layer substrate suits most basic TEC applications. For complex circuits, multi-layer structures are recommended.
Q: What is the maximum current capacity?
A: With 300μm copper thickness at 25℃ ambient temperature, it can continuously carry 50A current.
Q: Is customized copper thickness available?
A: Multiple copper thickness options from 120μm to 300μm are available.
Q: How is insulation performance ensured?
A: Alumina ceramic provides high insulation (breakdown voltage ≥10 kV/mm) with proper creepage distance design.
15×40mm DBC Alumina Ceramic Substrate - For Thermoelectric Coolers (TTC)
This product features a direct bonded copper alumina ceramic substrate specifically designed for elongated TEC modules. The high-temperature process creates strong bonding between copper and ceramic layers, offering excellent current carrying capacity and heat dissipation performance. The unique 15×40mm rectangular size is particularly suitable for TEC applications requiring linear heat flow management.
High current capacity with copper thickness up to 300μm
Good thermal conductivity (24-28 W/mK)
Strong bonding strength ≥20 N/mm²
Single-layer optimized design for cost-effectiveness
Elongated structure ideal for linearly arranged TEC arrays
High reliability with over 1000 thermal cycles endurance
Elongated TEC cooling modules
Industrial linear temperature control systems
Medical analyzer temperature control components
Communication cabinet local cooling
Laboratory platform temperature control
Power electronics thermal management
Q: What are the main differences between DBC and DPC processes?
A: DBC bonds copper foil to ceramic at high temperature with thicker copper layers for high current applications; DPC deposits copper through plating for finer circuits.
Q: Can single-layer substrate meet complex TEC circuit requirements?
A: This single-layer substrate suits most basic TEC applications. For complex circuits, multi-layer structures are recommended.
Q: What is the maximum current capacity?
A: With 300μm copper thickness at 25℃ ambient temperature, it can continuously carry 50A current.
Q: Is customized copper thickness available?
A: Multiple copper thickness options from 120μm to 300μm are available.
Q: How is insulation performance ensured?
A: Alumina ceramic provides high insulation (breakdown voltage ≥10 kV/mm) with proper creepage distance design.
