40×40mm DPC Aluminum Nitride Ceramic Substrate - For Semiconductor Thermoelectric Coolers
This product is a high-performance ceramic circuit board specifically designed for semiconductor thermoelectric coolers. Using aluminum nitride ceramic as the base material and employing direct plated copper technology to create precise circuit patterns, this substrate ensures efficient heat dissipation and stable operation of TEC devices with its exceptional thermal conductivity and electrical insulation properties. It is an ideal choice for demanding temperature control applications, with optimized thermal management design significantly improving the cooling efficiency and service life of TEC modules.
Superior thermal management performance with excellent thermal conductivity (170-200 W/mK)
Advanced DPC process ensures strong bonding strength and high circuit precision
Optimized 40×40mm size perfectly matches mainstream TEC chips
Double-layer circuit structure supports complex layout designs
High reliability with excellent thermal shock resistance
High current carrying capacity with thick copper design
Precision temperature control for lasers and optical communication equipment
Thermal management for high-power LED lighting systems
Temperature control systems for medical detection equipment
Automotive electronic cooling solutions
Aerospace temperature control systems
Heat dissipation management for high-power electronic components
Q: What are the advantages of AlN substrate compared to Al2O3?
A: AlN's thermal conductivity is 5-8 times higher than Al2O3, significantly improving heat dissipation efficiency.
Q: Can the substrate withstand frequent thermal cycling?
A: Yes, the DPC-prepared AlN substrate exhibits excellent thermal cycling performance.
Q: Is customized design supported?
A: Yes, we provide customization services for dimensions, circuit layouts and surface treatment.
Q: How is the insulation performance?
A: AlN ceramic offers excellent insulation with breakdown voltage >15kV/mm.
Q: What is the maximum current capacity?
A: Depending on copper thickness, maximum current capacity can exceed 30A.
40×40mm DPC Aluminum Nitride Ceramic Substrate - For Semiconductor Thermoelectric Coolers
This product is a high-performance ceramic circuit board specifically designed for semiconductor thermoelectric coolers. Using aluminum nitride ceramic as the base material and employing direct plated copper technology to create precise circuit patterns, this substrate ensures efficient heat dissipation and stable operation of TEC devices with its exceptional thermal conductivity and electrical insulation properties. It is an ideal choice for demanding temperature control applications, with optimized thermal management design significantly improving the cooling efficiency and service life of TEC modules.
Superior thermal management performance with excellent thermal conductivity (170-200 W/mK)
Advanced DPC process ensures strong bonding strength and high circuit precision
Optimized 40×40mm size perfectly matches mainstream TEC chips
Double-layer circuit structure supports complex layout designs
High reliability with excellent thermal shock resistance
High current carrying capacity with thick copper design
Precision temperature control for lasers and optical communication equipment
Thermal management for high-power LED lighting systems
Temperature control systems for medical detection equipment
Automotive electronic cooling solutions
Aerospace temperature control systems
Heat dissipation management for high-power electronic components
Q: What are the advantages of AlN substrate compared to Al2O3?
A: AlN's thermal conductivity is 5-8 times higher than Al2O3, significantly improving heat dissipation efficiency.
Q: Can the substrate withstand frequent thermal cycling?
A: Yes, the DPC-prepared AlN substrate exhibits excellent thermal cycling performance.
Q: Is customized design supported?
A: Yes, we provide customization services for dimensions, circuit layouts and surface treatment.
Q: How is the insulation performance?
A: AlN ceramic offers excellent insulation with breakdown voltage >15kV/mm.
Q: What is the maximum current capacity?
A: Depending on copper thickness, maximum current capacity can exceed 30A.
